镀银铜粉产品性能及特点：
镀银铜粉是在超细铜粉表面形成不同厚度的银镀层；与同类产品相比：抗氧化性能好，导电性好、电阻率低、具有高分散性和高稳定性；它既克服了铜粉易氧化的缺陷，又解决了银粉价格昂贵、易迁移等问题，是很有发展前途的一种高导电材料，是理想的以铜代银高性价比的导电粉末。
镀银铜粉是在超细铜粉表面形成不同厚度的银镀层；与同类产品相比：抗氧化性能好，导电性好、电阻率低、具有高分散性和高稳定性；它既克服了铜粉易氧化的缺陷，又解决了银粉价格昂贵、易迁移等问题，是很有发展前途的一种高导电材料，是理想的以铜代银高性价比的导电粉末。
Properties and characteristics of silver plated copper powder:
Silver plated copper powder is a kind of silver coating with different thickness formed on the surface of superfine copper powder. Compared with similar products, it has good oxidation resistance, good conductivity, low resistivity, high dispersion and high stability. It not only overcomes the defects of copper powder that is easy to oxidize, but also solves the problems of high price and easy to move of silver powder. It is a kind of high conductivity material with great development prospect. It is an ideal substitute of copper for silver High cost-effective conductive powder.
